IMMERSION COOLING SERVERS

Immersion cooling involves immersing computer components or entire servers in a thermally, but not electrically, conductive liquid (dielectric coolant). This method is becoming more and more popular due to the need to densify data centers and the increasing power requirements of chips designed by manufacturers. Computer equipment or servers cooled in this manner do not require fans and the heat exchange between the hot coolant and the cold water circuit is done through a heat exchanger.

Two principles of the immersion cooling technology exist, we already covered them up in other articles: single-phase immersion cooling and two-phase immersion cooling.

2CRSi's Servers Designed for Immersion Cooling

Our submerged servers have been specially designed for immersion:

All cables are accessible from the front of the server
The hot spots have been located downwards for more efficiency
We manufacture our own cables, thinner and more resistant to different fluids
Chassis are open for better heat exchange

2CRSi designs for immersion 19”

Atlantis 1.4

1U 19” Rackmount
GPU

Single or Dual processor. Up to 4 GPUS/FPGA.

Available in:

Single/Dual 3rd Gen Intel® Xeon®
Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

Atlantis 1.8

2U 19” Rackmount
GPU

Single or Dual processor. Up to 8 GPUS/FPGA.

Available in:

Single/Dual 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16 DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

Godi 1.4

1U 19” Rackmount
GPU

Single or Dual processor. Up to 4 GPUS/FPGA.

Available in:

Dual 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 32 DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

2CRSi designs for immersion 21”

Atlas 1.4

1U 21” Rackmount
GPU

Single or Dual processor. Up to 4 GPUS/FPGA.

Available in:

3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

Atlas 1.8

2U 21” Rackmount
GPU

Single or Dual processor. Up to 8 GPUS/FPGA.

Available in:

3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16 DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

LOGe 1.4

1U 21” Rackmount
GPU

Single or Dual processor. Up to 8 GPUS/FPGA.

Available in:

3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 32 DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

2CRSi designs for immersion OCP 21”

OCtoPus 1.4

1OU 21” OCP Rackmount
GPU

Single or Dual processor. Up to 4 GPUS/FPGA.

Available in:

3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications:

HPC
Rendering
AI/ML
GPU virtualization

OCtoPus 1.8

2OU 21” OCP Rackmount
GPU

Single or Dual processor. Up to 8 GPUS/FPGA.

Available in:

3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280WW
2x Internal M.2 NVMe drives (PCIe Gen4)
Up to 16 DIMM slots
I/O: 2x PCIe 4.0 x16 (HH-HL SW)

Applications: