IMMERSION COOLING SERVERS
Immersion cooling involves immersing computer components or entire servers in a thermally, but not electrically, conductive liquid (dielectric coolant). This method is becoming more and more popular due to the need to densify data centers and the increasing power requirements of chips designed by manufacturers. Computer equipment or servers cooled in this manner do not require fans and the heat exchange between the hot coolant and the cold water circuit is done through a heat exchanger.
Two principles of the immersion cooling technology exist, we already covered them up in other articles: single-phase immersion cooling and two-phase immersion cooling.
2CRSi's Servers Designed for Immersion Cooling
Our submerged servers have been specially designed for immersion:
- All cables are accessible from the front of the server
- The hot spots have been located downwards for more efficiency
- We manufacture our own cables, thinner and more resistant to different fluids
- Chassis are open for better heat exchange
2CRSi designs for immersion 19”

Atlantis 1.4
1U 19” Rackmount
GPU
Single or Dual processor. Up to 4 GPUS/FPGA.
Available in:
- Single/Dual 3rd Gen Intel® Xeon®
- Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

Atlantis 1.8
2U 19” Rackmount
GPU
Single or Dual processor. Up to 8 GPUS/FPGA.
Available in:
- Single/Dual 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16 DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

Godi 1.4
1U 19” Rackmount
GPU
Single or Dual processor. Up to 4 GPUS/FPGA.
Available in:
- Dual 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or Single/Dual AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 32 DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization
2CRSi designs for immersion 21”

Atlas 1.4
1U 21” Rackmount
GPU
Single or Dual processor. Up to 4 GPUS/FPGA.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

Atlas 1.8
2U 21” Rackmount
GPU
Single or Dual processor. Up to 8 GPUS/FPGA.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16 DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

LOGe 1.4
1U 21” Rackmount
GPU
Single or Dual processor. Up to 8 GPUS/FPGA.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 32 DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization
2CRSi designs for immersion OCP 21”

OCtoPus 1.4
1OU 21” OCP Rackmount
GPU
Single or Dual processor. Up to 4 GPUS/FPGA.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

OCtoPus 1.8
2OU 21” OCP Rackmount
GPU
Single or Dual processor. Up to 8 GPUS/FPGA.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280WW
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- Up to 16 DIMM slots
- I/O: 2x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Rendering
- AI/ML
- GPU virtualization

OCtoPus 3
1OU 21” OCP Rackmount
High density 3 nodes server
Single or Dual processor per node.
Available in:
- 3rd Gen Intel® Xeon® Scalable Processors TDP up to 270W or AMD EPYC 7002/7003 Series Processors TDP up to 280W
- 1x Internal M.2 NVMe drives (PCIe Gen4)
Optional :
- 2x Internal M.2 NVMe drives (PCIe Gen4)
- 4x 2.5’’ U.2 NVMe drives (PCIe Gen4)
- 3x 3.5’’ SATA 3 HDD (6Gbps)
- Up to 16 DIMM slots per node
- I/O: 1x PCIe 4.0 x16 (HH-HL SW)
Applications:
- HPC
- Cloud
- CPU virtualization
2CRSi's Immersion Cooling Tanks Partners

- Shell liquid
- 24U/OU
- Natural convection
- No CDU
- 15’’ or 21’’ form factor
- 32/60kW Cooling
- Liquid agnostic
- 24/42/84/168U
- Convection with pomp
- Internal & External CDU
- 19’’ or 21’’ form factor
- 25/50kW (24)50/180kW (42/84/168)

- Lubrizol liquid
- 6/21/45 U/OU
- Convection with pomp
- Internal & External CDU
- 19" or 21" form factor
- 7 (6U)/100kW (45U)

- Liquid agnostic
- 12U/50U/Container
- Convection with pomp
- External CDU
- 19’’ and custom form factor
- Up to 150kW
- N+1 Cooling

- Liquid agnostic
- 24/42U
- Convection with pomp
- External CDU
- 19’’ form factor
-
Up to 200kW N+1 Cooling