OCtoPus Servers

OCtoPus has been designed to further improve Data Center Energy Efficiency.

This range is specifically designed to execute complex workloads with its high sustainability. You will get the highest possible performance for your operations. The OCtoPus 3 is our open hardware, which is evolutive, efficient, and flexible to improve your IT infrastructure while providing cost reduction on CAPEX (up to -25%) and OPEX (up to -40% with immersion cooling).

OCtoPus 1.4E
Barebone OCtoPus 1.4 1OU 21" with 1 socket SP3 for 7**2/7**3 AMD EPYC processors. 8 DIMMs slots.
OCtoPus 1.4EE
Barebone OCtoPus 1.4EE 1OU 21" with 2 sockets SP3 for 7**2/7**3 AMD EPYC processors. 8 DIMMs slots per CPU.
OCtoPus 1.4iP
Barebone OCtoPus 1.4iP 1OU 21" with 2 sockets P+ for 3rd Generation Intel® Xeon® Scalable Processors. 24 DIMMs slots.
OCtoPus 1.8EE
Barebone 1OU 21" with 8 Dual Slots Accelerator - 2 sockets SP3 for AMD EPYC™ 7xx2 and 7xx3 Series Processor family - 16 DIMM/Node.
OCtoPus 1.8iP
Barebone 1OU 21" with 8 Dual Slots Accelerator - 2 sockets P+ for 3rd generation of Intel Xeon Scalable processors - 24 DIMM/Node.
OCtoPus 2EE
Barebone OCtoPus 2 1OU 21" composed of two blade nodes. DLC cooled with 2 sockets SP3 for 7**2/7**3 AMD EPYC processors. 8 DIMMs slots per CPU.
OCtoPus 3H (Rev. 1)
Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 1 socket H5 for Intel® Xeon® E-2300 Series Processors. 4 DIMMs slots per CPU.
OCtoPus 3R (Rev.1)
Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 1 socket AM4 for AMD Ryzen™ 3xxx/4xxx/4xxxG/5xxx/5xxxG-Series Processors. 4 DIMMs slots per node.
OCtoPus 3EE
Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 2 sockets SP3 for AMD EPYC 7xx2 and 7xx3 Series Processor family. 48 DIMMs slots (8-channel, 8-DIMM per CPU). Immersion cooling ready.