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- OCtoPus 2 AM5-S
- High Density Servers
Key Features
High-Speed DDR5 Memory
Four DDR5 UDIMM slots per node, supporting up to 192GB of memory and speeds up to 5600 MT/s, depending on processor and memory configuration.
2 Independent Nodes in 2 OpenU
Two independent compute nodes in a compact 21-inch OCP ORV3 chassis, maximizing computing density while optimizing rack space and infrastructure efficiency.
AMD AM5 Processors
Supporting AMD EPYC 4004/4005 and Ryzen 7000/9000 series processors with TDPs up to 170W, delivering high-frequency performance and excellent price-to-performance.
Accelerator-Ready Architecture
PCIe Gen5 expansion enables GPU, ASIC and FPGA integration, with selected configurations supporting double-width accelerators up to 300W per node.
Flexible Storage Options
Combine high-speed NVMe Gen5, M.2 and SATA storage to meet diverse workload requirements. Selected configurations offer front-access, hot-swappable E1.S SSD bays.
OCP ORV3, Made in France
Designed for 21-inch OCP Open Rack V3 infrastructure with 48V DC power distribution. Manufactured in Alsace, France, combining European engineering expertise with efficient data center integration.
OCP Inspired Server


Maximum Compute Density. Optimized Rack Efficiency.
Scale your computing power, not your infrastructure footprint.
Built around the 2CRSi OCtoPus 2 AM5-S, this high-density rack architecture combines performance, scalability, and energy efficiency in a compact OCP Open Rack V3 environment.
With two independent compute nodes in just 2 OpenU, each server maximizes processing capacity while leveraging power-efficient AMD EPYC™ 4004/4005 and Ryzen™ processors, DDR5 memory, and flexible networking options.
Designed for cloud providers, hosting platforms, and scale-out infrastructures, this modular approach enables organizations to deploy more compute resources within a controlled power and cooling envelope.
More nodes. Greater density. Smarter infrastructure.
AMD EPYC™ and RYZEN™
AMD Ryzen™ 7000/8000/9000 and EPYC™ 4005 Series processors deliver up to 16 cores, 32 threads and boost frequencies up to 5.7 GHz, engineered for compute-intensive professional workloads and scalable server infrastructure.
Leveraging the AM5 platform, both lineups support DDR5 memory and PCIe® 5.0, ensuring maximum throughput for NVMe storage, high-speed networking and GPU acceleration. The EPYC™ 4005 Series further extends this foundation to single-socket server deployments, addressing SMB virtualization, dedicated hosting and general-purpose infrastructure needs with server-class reliability.
With cross-generation AM5 socket compatibility, organizations benefit from a long-term, upgradeable platform that minimizes hardware refresh cycles while maintaining performance headroom for evolving workloads.

Built for Acceleration. Designed for Flexibility.
GPU & FPGA Acceleration. Up to 300W per Node
Go beyond traditional CPU computing with the 2CRSi OCtoPus 2 AM5-S. Each independent compute node can accommodate a PCIe Gen5 x16 accelerator, with configurations supporting professional GPUs or FPGA cards up to 300W.
From AI inference and parallel computing to specialized hardware acceleration, this flexible architecture delivers powerful, workload-optimized performance while maintaining exceptional compute density.
PCIe Gen5 x16 | Up to 300W | GPU & FPGA Ready
System | |
Form Factor | 21-inch 2 OpenU |
Dimension (Server) | 809.25 x 537 x 93.5mm (D x W x H) |
Nodes | 2 |
Cooling | Air cooling |
Storage | |
Internal | 1x M.2 NVMe PCIe 5.0 x4 2242/2280 (CPU) |
External | Optional 2x E1.S NVMe hot-swappable bays (Gen5 x16 |
RAID Controler |
MegaRAID 9760W-16i (Gen5) Tri-Mode RAID Adapter (Optional) |
Motherboard | |
CPU | Socket AM5[JC1.1][LN1.2] (LGA 1718) |
Chipset | System on chip |
Expansions slots | 1x PCIe (Gen5 x16 link) from CPU FH-FL (for GPUs/Asic/FPGA, up to 300W, internal* or 1x PCIe (Gen5 x16 link) from CPU, LP, HH-HL, front access* or 1x PCIe (Gen5 x4 link) from FCH, HH-HL, front access* *depend on the SKUs |
BMC | Aspeed® AST2600 |
TPM | 1x TPM header with SPI interface for TPM 2.0 module (optional) |
Memory | |
Total slots | 8x (2-channel per CPU, 4 DIMM per CPU) |
Capacity | UDIMM modules up to 48GB supported |
Memory type | AMD EPYC™ 4005 / Ryzen™ 9000: |
Network | 1x Realtek RTL8211F for dedicated management GLAN |
I/O | |
Front | 2x USB 3.2 Gen1 type A |
Switch/LED | 1x Power button with LED |
Management Solution | |
Software | WebGUI, IPMI 2.0 and RESTful APIs (Redfish) |
Remote management | iKVM module, Remote Update (OoB), Platform Firmware |
Power Supply | |
Type | 12V DC Busbar connector compliant to OCP ORv1 and ORv2 |
Warranty | 2CRSi hardware warranty includes a one year, parts and labour with return to 2CRSi selling entity. Customers may purchase an extended warranty of up to 3 years on parts and labour with different support levels. Please contact 2CRSi at support@2crsi.com or reach your sales point of contact for complete warranty details including limitations and transferability. |
SKUs list :
SKU | Storage | Expansion slots | Network |
SKU 1 : NOD-OC2-200-AM5-R3101 | 1x M.2 (2242/2280), NVMe Gen5 x4 link, PCIe from CPU 1x 2.5’’ NVMe Gen 4 x4 link from FCH (internal) 4 x 3.5’’ SATA 6Gbps HDDs (internal) | 1x PCIe Gen5 x16 link from CPU, LP, HH-HL, front access | 2 x 10GbE LAN (1 x Intel® X710-AT2) |
SKU 2 : NOD-OC2-200-AM5-R3102 | 1x M.2 (2242/2280), NVMe Gen5 x4 link, PCIe from CPU 1x 2.5’’ NVMe Gen 4 x4 link from FCH (internal) 2x E1.S NVMe Gen5 x4 (Front access, hot swappable) 3x 3.5’’ SATA 6Gbps HDDs (internal) | 1x PCIe Gen5 x8 link from CPU, LP, HH-HL, front access | 2x 25GbE LAN (1x Broadcom® BCM57502) |
SKU 3: NOD-OC2-201-AM5-R3103 | 1x M.2 (2242/2280), NVMe Gen5 x4 link, PCIe from CPU 1x 2.5’’ NVMe Gen4 x4 link from FCH (internal) 3x 3.5’’ SATA 6Gbps HDDs (internal) | 1x PCIe Gen5 x16 link from CPU, DW FH-FL for GPUs/Asic/FPGA, up to 300W, internal | 2 x 10GbE LAN (1 x Intel® X710-AT2) |
SKU 4 : NOD-OC2-201-AM5-R3104 | 1x M.2 (2242/2280), NVMe Gen5 x4 link, PCIe from CPU 2x 2.5’’ NVMe Gen5 x4 link 3x 3.5’’ SATA 6Gbps HDDs (internal) | 1x PCIe Gen5 x16 link from CPU, DW FH-FL for GPUs/Asic/FPGA, up to 300W, internal | 2x 25GbE LAN (1x Broadcom® BCM57502) |
SKU 5 : NOD-OC2-201-AM5-R3105 | 1x M.2 (2242/2280), NVMe Gen5 x4 link, PCIe from CPU 2x 2.5’’ NVMe Gen5 x4 (internal) 4x 3.5’’ SATA 6Gbps HDDs (internal) 2x E1.S NVMe Gen5 x4 (Front access, hot swappable) | 1x PCIe Gen5 x4 link from FCH, HH-HL, front access | 2x 25GbE LAN (1x Broadcom® BCM57502) |