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- Godì 1.8E2D-NV8 DLC
- GPU & AI Servers
NVIDIA Blackwell Series
HGX B300 DLC Server

The Godì 1.8E2D-NV8 DLC combines 8 NVIDIA Blackwell Ultra GPUs with dual Intel® Xeon® 6 Scalable processors to tackle the most demanding AI workloads.
It offers 8 embedded CX8 SuperNIC, 4 PCIe expansion slots, 32 DIMM slots, 12 NVMe drive bays and dual 10GbE LAN.
Purpose-built for LLMs, scientific computing, and AI model training and inference, it is the ideal platform for large enterprises, cloud service providers, research institutions, as well as the financial and automotive sectors.
Image courtesy of NVIDIA. 
NVIDIA Blackwell Ultra
NVIDIA Blackwell breaks new ground with its Transformer Engine, built around a technique called micro-tensor scaling. This approach makes FP4, 4-bit floating point AI, both practical and precise, without sacrificing accuracy.
Memory can now support models twice as large, running twice as fast. NVIDIA's NVFP4 format turns this into a competitive advantage for AI factories, enabling faster training of bigger models at a lower cost.
NVIDIA Networking: 8 embedded CX-8 SuperNIC
The Godì 1.8E2D-NV8 DLC integrates 8 CX8 ports supporting InfiniBand XDR and 800G Ethernet, each directly connected to a B300 SXM module.
This means up to 800G/s of raw throughput, delivered natively, with none of the bottlenecks that come with external adapters.
The benefits go beyond speed. Ultra-low latency keeps AI workloads running at full throttle, while the simplified architecture cuts down on cabling, reduces power consumption, and frees up valuable space inside the server chassis.


Cooled by Direct Liquid Cooling
DLC is high-performance cooling technology designed for AI and HPC servers.
By circulating liquid through cold plates in direct contact with CPUs and GPUs, it enables efficient heat removal at the source.
Suitable for high-density environments exceeding 100 kW per rack, DLC ensures stable performance, reduces energy consumption, and improves overall data center efficiency while remaining compatible with standard rack architectures.
Turnkey Rack Scale Solution
Redefine Your AI Infrastructure at Scale
This AI DLC rack solution, built on the NVIDIA HGX™ B300 platform, is a turnkey supercomputing system engineered for the most demanding AI workloads. From large language model training to agentic AI and real-time video inference, this solution delivers uncompromising performance, thermal efficiency, and operational simplicity, all within a single, fully integrated rack.
Scalable from Day One
This ecosystem is designed to grow with your business. If you are deploying a single rack or scaling to a multi-rack AI supercomputer with hundreds of GPUs, we provide a proven, end-to-end solution backed by deep partnerships with NVIDIA.
As an NVIDIA-certified partner, we propose NVIDIA Certified Reference Designs, guaranteeing that every component, configuration, and deployment meets NVIDIA's rigorous validation standards for AI infrastructure. This certification ensures maximum compatibility, optimized performance, and long-term reliability for your mission-critical workloads.

DLC Rack Scale Solution - Technical Specifications
Cooling Type | Direct Liquid Cooling |
Rack Height | 42U |
Server Configuration | 8 x 4U DLC GPU servers |
Max rack power | 109 kW |
Liquid Cooling Heat Capture | 92% |
Switch | Flexible validated InfiniBand / Ethernet switch configurations |
Management | Integrated power and cooling management kit: - 1x management node - Real-time cluster-level monitoring and control - Supports Modbus, Redfish, and REST APIs for seamless integration with CDUs and RDHx Optional POD Management software suite: - Essential single-node BMC for real-time hardware health and remote system oversight - Unified cluster-scale management and deep telemetry for high-density deployments - Total POD-level orchestration for infrastructure provisioning and environmental monitoring |
Storage Solutions | Flexible validated partner solutions with 2CRSi storage servers |
Intel® Xeon® 6 Processor Family
The Intel Xeon 6 family combines two complementary architectures to meet modern data center needs.
P-core models (Granite Rapids) deliver maximum performance for AI, HPC, and enterprise workloads, while E-core models (Sierra Forest) provide unmatched efficiency and density for cloud-native and scale-out applications.
With support for DDR5, PCIe 5.0, CXL 2.0, and built-in AI acceleration (Intel AMX), Xeon 6 processors offer the scalability, performance, and efficiency required for next-generation computing.
| System | |
|
Model (Barebone)
| BRB-GI1-408-E2D-S2102 |
| Form Factor | 19-inch 4U |
Dimension | 448mm x 900mm x 175 (W x D x H) 17.6” x 35.4” x 6.9” (W x D x H) |
Cooling Technology | Direct Liquid Cooling (DLC) |
| Storage | |
Internal type | 1x M.2 (PCIe5.0 x4); Form factor: 22110/2280 [CPU1] 1x M.2 (PCIe5.0 x2); Form factor: 22110/2280 [CPU1] |
| External type | 8 Hot-swap 2.5” NVMe (PCIe5.0 x4) drive bays [PCIe switch] |
RAID controler | Add-in card or VROC in option |
GPU |
NVIDIA® HGX™ B300 NVL8 |
| Motherboard | |
| CPU | Supports Intel® Xeon® 6500P/6700E/6700P Series Processors Dual Socket E E2 (LGA 4710). Max TDP up to 350W |
|
Chipset
| System on Chip |
| Expansions slots | Rear: 4 Single-slot FHHL PCIe5.0 x16 [PCIe switch] The ambient temperature is limited to 30°C when NVIDIA BlueField-3 DPUs/SuperNIC are installed. |
| BMC | ASPEED AST2600 |
| TPM | TPM header with SPI interface (optional TPM2.0 kit available). |
| Memory | |
| Total Slots | 32x (8 channels per CPU, up to 2 DIMMs per channel) |
| Capacity | Up to 8TB, from RDIMM: Max 128GB module, MRDIMM: Max 64GB module |
| Memory Type | RDIMM: 6400MT/s (1DPC), 5200MT/s (2DPC) MRDIMM: 8000MT/s (1DPC only and Intel processors with P-cores) |
|
Network | 1x 1GbE Management Port dedicated to the IPMI 2x 10GbE LAN (Intel X710-AT2 controller) 8x NVIDIA ConnectX-8 OSFP Ports (800Gb/s) |
| I/O | |
|
Front I/O Ports
| 2x 10GbE RJ45 1x IPMI RJ45 (default) 2x USB 3.2 Gen1 1x VGA 1x Power button LED / UID button / NMI button / Reset button 1x Storage activity LED / System status LED |
Rear I/O Ports | 8x NVIDIA ConnectX-8 OSFP Ports (800Gb/s) 1x IPMI RJ45, shared with front panel |
| Management Solution | |
Software | WebGUI, IPMI 2.0 and RESTful APIs (Redfish) |
|
Out of Band Remote Management | iKVM module |
| Power supply | |
Type | 5+5 Redundant 3000W 80 PLUS Titanium Power Supply |
Power rating | ~14 kW at 100% Load |
Operating environement | Operating temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating temperature: -40°C ~ 70°C (40° ~ 158°F) Operative relative humidity :8% to 80% (non-condensing) Non-operating relative humidity: 20% ~ 90% (non-condensing) |
Compatibility