OCtoPus 2 AM5-S
Barebone OCtoPus 2 1OU 21" composed of two blade nodes. DLC cooled with 2 sockets SP5 for 9004/9005 AMD EPYC™ processors. 8 DIMMs slots per CPU.
| Cooling system: Air Cooling |
| CPU brand: AMD |
| Number of sockets: 1 per node |
| GPU/FPGA: 1 slot per node |
| CPU socket: AM5 (LGA 1718) |
| Memory slots: 8 slots |
| Form factor: 21" 2OU |
Key Features
High-Speed DDR5 Memory
Four DDR5 UDIMM slots per node, supporting up to 192GB of memory and speeds up to 5600 MT/s, depending on processor and memory configuration.
2 Independent Nodes in 2 OpenU
Two independent compute nodes in a compact 21-inch OCP ORV3 chassis, maximizing computing density while optimizing rack space and infrastructure efficiency.
AMD AM5 Processors
Supporting AMD EPYC 4004/4005 and Ryzen 7000/9000 series processors with TDPs up to 170W, delivering high-frequency performance and excellent price-to-performance.
Accelerator-Ready Architecture
PCIe Gen5 expansion enables GPU, ASIC and FPGA integration, with selected configurations supporting double-width accelerators up to 300W per node.
Flexible Storage Options
Combine high-speed NVMe Gen5, M.2 and SATA storage to meet diverse workload requirements. Selected configurations offer front-access, hot-swappable E1.S SSD bays.
OCP ORV3, Made in France
Designed for 21-inch OCP Open Rack V3 infrastructure with 48V DC power distribution. Manufactured in Alsace, France, combining European engineering expertise with efficient data center integration.
OCP Inspired Server
Maximum Compute Density. Optimized Rack Efficiency.
Scale your computing power, not your infrastructure footprint.
Built around the 2CRSi OCtoPus 2 AM5-S, this high-density rack architecture combines performance, scalability, and energy efficiency in a compact OCP Open Rack V3 environment.
With two independent compute nodes in just 2 OpenU, each server maximizes processing capacity while leveraging power-efficient AMD EPYC™ 4004/4005 and Ryzen™ processors, DDR5 memory, and flexible networking options.
Designed for cloud providers, hosting platforms, and scale-out infrastructures, this modular approach enables organizations to deploy more compute resources within a controlled power and cooling envelope.
More nodes. Greater density. Smarter infrastructure.
AMD EPYC™ and RYZEN™
AMD Ryzen™ 7000/8000/9000 and EPYC™ 4005 Series processors deliver up to 16 cores, 32 threads and boost frequencies up to 5.7 GHz, engineered for compute-intensive professional workloads and scalable server infrastructure.
Leveraging the AM5 platform, both lineups support DDR5 memory and PCIe® 5.0, ensuring maximum throughput for NVMe storage, high-speed networking and GPU acceleration. The EPYC™ 4005 Series further extends this foundation to single-socket server deployments, addressing SMB virtualization, dedicated hosting and general-purpose infrastructure needs with server-class reliability.
With cross-generation AM5 socket compatibility, organizations benefit from a long-term, upgradeable platform that minimizes hardware refresh cycles while maintaining performance headroom for evolving workloads.
Built for Acceleration. Designed for Flexibility.
GPU & FPGA Acceleration. Up to 300W per Node
Go beyond traditional CPU computing with the 2CRSi OCtoPus 2 AM5-S. Each independent compute node can accommodate a PCIe Gen5 x16 accelerator, with configurations supporting professional GPUs or FPGA cards up to 300W.
From AI inference and parallel computing to specialized hardware acceleration, this flexible architecture delivers powerful, workload-optimized performance while maintaining exceptional compute density.
PCIe Gen5 x16 | Up to 300W | GPU & FPGA Ready