OCtoPus Servers

OCtoPus has been designed to further improve Data Center Energy Efficiency.

This range is specifically designed to execute complex workloads with its high sustainability. You will get the highest possible performance for your operations. The OCtoPus is our open hardware, which is evolutive, efficient, and flexible to improve your IT infrastructure while providing cost reduction on CAPEX (up to -25%) and OPEX (up to -40% with immersion cooling).

OCtoPus 1G0 Barebone OCtoPus 1G0 1OU 21" with 1 SP5 socket for 9004 AMD EPYC™ processors. 24 DIMMs slots.	OCtoPus 1.4E Barebone OCtoPus 1.4 1OU 21" with 1 socket SP3 for 72/73 AMD EPYC™ processors. 8 DIMMs slots.	OCtoPus 1.4EE Barebone OCtoPus 1.4EE 1OU 21" with 2 sockets SP3 for 72/73 AMD EPYC™ processors. 8 DIMMs slots per CPU.
OCtoPus 1.4iP Barebone OCtoPus 1.4iP 1OU 21" with 2 sockets P+ for 3rd Generation Intel® Xeon® Scalable Processors. 24 DIMMs slots.	OCtoPus 1.8EE Barebone 2OU 21" with 8 Dual Slots Accelerator - 2 sockets SP3 for AMD EPYC™ 7xx2 and 7xx3 Series Processor family - 16 DIMMs/Node	OCtoPus 1.8iP Barebone 2OU 21" with 8 Dual Slots Accelerator - 2 sockets P+ for 3rd generation of Intel® Xeon® Scalable processors - 24 DIMM/Node.
OCtoPus 2EE Barebone OCtoPus 2 1OU 21" composed of two blade nodes. DLC cooled with 2 sockets SP3 for 72/73 AMD EPYC™ processors. 8 DIMMs slots per CPU.	OCtoPus 3H (Rev. 1) Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 1 socket H5 for Intel® Xeon® E-2300 Series Processors. 4 DIMMs slots per CPU.	OCtoPus 3R (Rev.1) Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 1 socket AM4 for AMD Ryzen™ 3xxx/4xxx/4xxxG/5xxx/5xxxG-Series Processors. 4 DIMMs slots per node.
OCtoPus 3EE Barebone OCtoPus 3 1OU 21" composed of three blade nodes with 2 sockets SP3 for AMD EPYC™ 7xx2 and 7xx3 Series Processor family. 48 DIMMs slots (8-channel, 8-DIMM per CPU). Immersion cooling ready.	OCtoPus 1.4G0