- All products
- RACKMOUNT SERVERS
- High Density Servers
- Cloe 10 BR-D DLC
- High Density Servers
Maximum compute density, minimum footprint

When rack space is scarce and workload density is high, every U counts. This 6U 10-Node DLC blade server fits 10 fully independent compute nodes into a single 6U chassis, that's 20 processors, 240 DIMM slots and 20 E3.S Gen5 NVMe bays, all liquid-cooled, all front-accessible.
Each node runs independently with its own OS, its own storage and its own PCIe expansion. The chassis manages power and cooling centrally, with 6+6 redundant 3200W 80 PLUS Titanium power supplies and a fully integrated DLC manifold keeping every node stable at sustained load.
Designed for:
- Hyperscale and cloud-native infrastructure
- HPC clusters requiring maximum node density per rack
- Hybrid and private cloud deployments
- High-throughput networking and data analytics
- Operators looking to reduce PUE without major facility changes
Full-system DLC with integrated manifold: 92% heat capture
The entire thermal architecture of this system is built around a single integrated liquid cooling manifold. Every heat-generating component (CPUs, memory, storage, PCIe cards) has a dedicated cold plate connected to the same coolant loop.
The result is a 92% heat capture ratio (HCR): the vast majority of the heat produced never reaches the ambient air. This means:
- Drastically reduced fan load, only 4 x 80mm system fans for the entire 6U chassis
- Compatibility with warm water cooling up to 45°C inlet temperature, no chilled water required
- A significantly lower PUE, even in facilities with limited air cooling capacity
- Stable, sustained compute performance with no thermal throttling
The manifold design also simplifies servicing, all nodes are front-accessible without disturbing the cooling loop.
The liquid coolant contained within the tubes, is a mixture of demineralized water and propylene glycol with the following beneficial features: Anti-Freeze, Anti-Corrosion and Anti Bacterial.

Illustration: Liquid Cooled components
Peak performance, sustained
Liquid-cooled components run well within their thermal limits, keeping servers stable and delivering consistently high performance.
Lower power, same output
Fewer fans, lower speeds, same performance: liquid-cooled servers match air-cooled output while drawing less power.
Quiet operation
Air cooling means banks of high-speed, high-noise fans. 2CRSi's liquid cooling cuts fan count, and noise, dramatically.
Decades of cooling expertise
Our liquid cooling supplier brings 20 years of cooling expertise across desktop PCs and data centers, backed by 2CRSi's own 10+ years in the field.
Built to run and last
Liquid cooling systems are monitored continuously and need little maintenance, with component warranties from 2CRSi and our cooling partners.
Ease of use
2CRSi servers with liquid cooling kits mount straight into a rack or tie into a building's water system, with quick, easy, dry-break disconnects.
Intel® Xeon® 6 Processor Family
The Intel Xeon 6 family combines two complementary architectures to meet modern data center needs.
P-core models (Granite Rapids) deliver maximum performance for AI, HPC, and enterprise workloads, while E-core models (Sierra Forest) provide unmatched efficiency and density for cloud-native and scale-out applications.
With support for DDR5, PCIe 5.0, CXL 2.0, and built-in AI acceleration (Intel AMX), Xeon 6 processors offer the scalability, performance, and efficiency required for next-generation computing.
| System | |
Model | Cloe 10 BR-D DLC |
| Form factor | 6U 10-Node |
Dimension (W x H x D) |
447 x 262.3 x 900 mm |
Storage | |
External type | Front: 2 x E3.S Gen5 NVMe per node, from CPU_0 |
Motherboard | |
Chipset | System on Chip |
CPU | Intel® Xeon® 6900E+ (Clearwater Forest) Processors Intel® Xeon® 6900-Series (Granite Rapids AP) Processors |
Socket | Dual socket per node, TDP up to 500 W. 20 x LGA 7529 |
Chipset | System on Chip |
Expansions slots | |
Expansions slots | 2 x LP x16 (Gen5 x16) per node, from CPU_0 |
TPM Module | 1x TPM header with SPI interface for TPM 2.0 module (optional) per node |
BMC | ASPEED® AST2600 |
Memory | |
Total Slots | 24 DIMM slots (12-Channel per CPU, 12 DIMM per CPU) per node |
Total Capacity | Up to 3TB RDIMM: Max 128GB module MRDIMM: Max 64GB module |
Memory Type | Support DDR5 RDIMM/MRDIMM* Intel Xeon 6900E+:
Intel Xeon 6900-series:
*MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores. |
Network | |
Onboard | Front: 1 x 10/100/1000 Mb/s Management LAN per node |
I/O
|
|
Front | Per node: |
Rear | 2 x CMC ports* 1 x CMC status LED *Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. |
Power Supply
| |
Type | 6+6 Redundant 3200W CRPS PSUs* *The system power supply requires C19 power cord. |
Cooling | |
Chassis | 4 x 80x80x80mm |
Node | Fully liquid-cooled (CPUs, DIMMs, NVMe, PCIe slots) |
Management Solution | |
Software | ASPEED® AST2600 management controller |
Remote Management | BMC Remote control based on Aspeed® AST2600 remote management controller (Power Control Configuration, Chassis Identify, Boot Option, iKVM, BMC Account Configuration) |
Operating Properties | Operating temperature: 10°C to 35°C Operating humidity*: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) *To prevent condensation and maintain system stability, whenever relative humidity exceeds 50%, the coolant inlet temperature must stay above the dry-bulb temperature, with a maximum of 45°C. |